Project Details
Description
The FHS, in this extension of the project cooperation, is carrying out consulting and development activities as part of the client's in-house innovation project. These activities extend to an additional use case for digital image analysis, deep data, and machine learning. A key task remains the active co-development of the client's innovation project.
The primary topics are:
(1) Supporting the further development of the prototype for fracture prediction in silicon wafers, which was developed in the previous project phase (AP2).
(2) Consulting and developing a prototype for image and data analysis of epitaxially coated wafers.
The consulting focus is on technological knowledge transfer as well as intensive exchange with the Siltronic Group, which includes dynamically discussed project questions and content for the development of the innovation project.
The primary topics are:
(1) Supporting the further development of the prototype for fracture prediction in silicon wafers, which was developed in the previous project phase (AP2).
(2) Consulting and developing a prototype for image and data analysis of epitaxially coated wafers.
The consulting focus is on technological knowledge transfer as well as intensive exchange with the Siltronic Group, which includes dynamically discussed project questions and content for the development of the innovation project.
| Acronym | DIDAV |
|---|---|
| Status | Finished |
| Effective start/end date | 1/10/17 → 31/03/19 |
Collaborative partners
- Salzburg University of Applied Sciences GmbH (lead)
- Siltronic AG (Project partner)
Keywords
- image analysis
- machine learning
- Fracture Prediction
- Wafer-Analyse
Classification according to Österreichische Systematik der Wissenschaftszweige (ÖFOS 2012)
- 202022 Information technology
Applied Research Level (ARL)
- ARL Level 6 - Principle in operating environment
Research focus/foci
- Industrial Informatics
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