Deep Image & Data Analysis Verlängerung

Project: Contract research

Project Details

Description

The FHS, in this extension of the project cooperation, is carrying out consulting and development activities as part of the client's in-house innovation project. These activities extend to an additional use case for digital image analysis, deep data, and machine learning. A key task remains the active co-development of the client's innovation project.

The primary topics are:
(1) Supporting the further development of the prototype for fracture prediction in silicon wafers, which was developed in the previous project phase (AP2).
(2) Consulting and developing a prototype for image and data analysis of epitaxially coated wafers.

The consulting focus is on technological knowledge transfer as well as intensive exchange with the Siltronic Group, which includes dynamically discussed project questions and content for the development of the innovation project.
AcronymDIDAV
StatusFinished
Effective start/end date1/10/1731/03/19

Collaborative partners

Keywords

  • image analysis
  • machine learning
  • Fracture Prediction
  • Wafer-Analyse

Classification according to Österreichische Systematik der Wissenschaftszweige (ÖFOS 2012)

  • 202022 Information technology

Applied Research Level (ARL)

  • ARL Level 6 - Principle in operating environment

Research focus/foci

  • Industrial Informatics

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